Semiconductor packaging and testing equipment

Semiconductor packaging and testing equipment

SWS-100 Wafer Sorting System
    Release time:2022-04-14    


Product Information

− UPH >2000

− AOI inspection for wafer surface defective Vision 

− Electric resistance testing

− Wafer thickness measurement

− Wafer size : 5/6 inch

− Supported:SECS/GEM

− MTBA : 60 min

− MTBF : 168 hrs

− Foot print : H1700 x W2200 x L8400mm

− Net weight : 6000kg