Semiconductor packaging and testing equipment
Product Information
− UPH >2000
− AOI inspection for wafer surface defective Vision
− Electric resistance testing
− Wafer thickness measurement
− Wafer size : 5/6 inch
− Supported:SECS/GEM
− MTBA : 60 min
− MTBF : 168 hrs
− Foot print : H1700 x W2200 x L8400mm
− Net weight : 6000kg