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Semiconductor packaging and testing equipment

Semiconductor packaging and testing equipment

Semiconductor packaging and testing equipment
SFB-150 Inline Flipper System
    Release time:2022-04-14    


The SFB-150 performs the flipping of FCBGA Package prior to ball mount process.

− UPH ＞150

− Stand along or in-line system to operate

− FCBGA substrate flipping

− AOI inspection available 

− CCTV monitoring

− Foot print :  H1700 x  W1300 x  L2150mm

− Net weight : 1400kg