Semiconductor packaging and testing equipment

Semiconductor packaging and testing equipment

STP-180 Lead Frame Fully Auto Taping System
    Release time:2022-04-14    


Product Information

The STP-180 Taping System is a fully automatic machine especially designed for Thermo-plastic Type Cover Lay Attachment to  QFN/DFN Lead Frame.

−  UPH >100

−  Lead frame size  : 60x200-100x300mm

−  Tape type : PI 胶带

 −  Lamination accuracy  : ±0.2mm 

−  MTBA : 60 min 

−  MTBF : 168 hrs

−  Foot print :  H2750 x  W1220 x  L2575mm

−  Net weight  : 3200kg