Semiconductor packaging and testing equipment
Product Information
The STP-180 Taping System is a fully automatic machine especially designed for Thermo-plastic Type Cover Lay Attachment to QFN/DFN Lead Frame.
− UPH >100
− Lead frame size : 60x200-100x300mm
− Tape type : PI 胶带
− Lamination accuracy : ±0.2mm
− MTBA : 60 min
− MTBF : 168 hrs
− Foot print : H2750 x W1220 x L2575mm
− Net weight : 3200kg