Shanghai, March 25–27, 2026 – SimTech (Sim Tech（suzhou） Co., Ltd.), a leading domestic provider of automated semiconductor packaging and testing equipment, made a strong impression at Electronica China 2026, held at the Shanghai New International Expo Centre. With a compelling showcase of core equipment and solutions, SimTech stood out as one of the most visited booths in Hall E5, demonstrating solid technical expertise and professional service.

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Throughout the exhibition, SimTech’s booth attracted numerous industry peers and experts for in-depth discussions. Our team delivered professional, enthusiastic service, explaining equipment features in detail and sharing the latest technological trends in semiconductor packaging and testing. From automatic film laminating and delaminating to wafer expansion and wet process equipment, visitors gained a deep appreciation of SimTech’s accumulated know-how and innovation in customizing non-standard automation equipment.

Among the highlights was the automatic laminating machine, a core solution for protective film lamination on semiconductor substrates. With ±0.1mm high-precision lamination, dual-station efficient operation, and a vision inspection system for full quality assurance, this equipment significantly improves packaging yield. It is widely used in substrate lamination processes for package types such as FCBGA and FCCSP, drawing keen interest from many industry professionals.

The wafer expander was another star product. By uniformly stretching the dicing tape, it precisely increases die spacing and effectively prevents chipping risks during subsequent pick-up. Suitable for 6", 8", and 12" wafer expansion processes, this machine, together with other equipment, forms a complete solution matrix covering multiple sizes and process requirements, fully showcasing SimTech’s comprehensive strength in semiconductor packaging and testing automation.

The exhibition was not only a stage for equipment demonstration but also a window for deep customer engagement. SimTech remains committed to the philosophy of “making automation understand semiconductors better,” continuously providing customized, high-precision automation solutions for the semiconductor packaging and testing industry. Looking ahead, we will continue to delve deeper into this field, joining hands with our customers to explore new breakthroughs and new value in domestically developed automation equipment for the semiconductor industry.

We extend our sincere gratitude to everyone who visited our booth. We look forward to meeting you again!